Yuexin Semiconductor Project Phase II Listed in Guangzhou's 2021 Key Project Plan
Source: Global Semiconductor Watch 2021-03-25
A few days ago, the Guangzhou Development and Reform Commission issued the "Guangzhou 2021 Key Construction Project Plan" and the "Guangzhou 2021 Key Construction Preliminary Project Plan." In 2021, there will be 666 official key construction projects in Guangzhou, with an annual planned investment of 341.7 billion yuan; a total of 111 key construction preparatory projects, with an annual investment plan of 18.6 billion yuan.
According to the list of key construction projects, the second phase of the Yuexin Semiconductor Project is listed. Information shows that the second phase of the Yuexin Semiconductor Project will build a new 90-55 nanometer high-end analog process production line, and increase the monthly production capacity of 20,000 12-inch wafer chips. The "Guangzhou Huangpu District, Guangzhou Development Zone 2021 Key Construction Project Schedule" further shows that the second phase of the Yuexin Semiconductor Project will complete the clean room decoration, equipment installation and production auxiliary facilities construction in 2021.
According to the official website, Yuexin Semiconductor is the first domestic 12-inch chip manufacturing company with "customized foundry" as its operating strategy and focusing on analog chip manufacturing. It owns the first 12-inch chip production line in Guangzhou, and is also Guangdong Province, Guangdong, Hong Kong and Macau. The only 12-inch chip production platform that has entered mass production in the Greater Bay Area.
Earlier news showed that the first phase of the Yuexin Semiconductor Project was officially announced and put into production on September 20, 2019. In February 2020, the second phase expansion project of Yuexin Semiconductor was successfully signed, and the second phase construction will increase investment of 6.5 billion yuan.
In addition, in the list of key construction preparatory projects, the third-generation compound semiconductor research and development headquarters and production base projects, and the third-generation semiconductor new material production and construction projects are included.